A Review of Prognostics and Health Management for Power Semiconductor Modules
In this paper, a review of current techniques used in the prognostics and state-of-health monitoring for power semiconductor modules is provided. Given the increasing trend in power modules having a larger share of the power electronic market, understanding their lifetime limitations is critical to improving the life-cycle cost of the power electronic product. Hence, this paper reviews common failure mechanisms in power modules and the state-of-art in predicting the lifetime of the module based on a given mission profile. Prognostics are reviewed in terms of stress- based and condition monitoring-based methods, while the potential of prognostics is presented for applications that utilize power modules.
How to Cite
reliability, on-line condition monitoring, Power semiconductor modules, Power electronics, Asset management
The Prognostic and Health Management Society advocates open-access to scientific data and uses a Creative Commons license for publishing and distributing any papers. A Creative Commons license does not relinquish the author’s copyright; rather it allows them to share some of their rights with any member of the public under certain conditions whilst enjoying full legal protection. By submitting an article to the International Conference of the Prognostics and Health Management Society, the authors agree to be bound by the associated terms and conditions including the following:
As the author, you retain the copyright to your Work. By submitting your Work, you are granting anybody the right to copy, distribute and transmit your Work and to adapt your Work with proper attribution under the terms of the Creative Commons Attribution 3.0 United States license. You assign rights to the Prognostics and Health Management Society to publish and disseminate your Work through electronic and print media if it is accepted for publication. A license note citing the Creative Commons Attribution 3.0 United States License as shown below needs to be placed in the footnote on the first page of the article.
First Author et al. This is an open-access article distributed under the terms of the Creative Commons Attribution 3.0 United States License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original author and source are credited.