Impact of Modulation Frequencies on the Lifetime of Power Semiconductor Modules for EV Applications

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Published Oct 2, 2017
Quentin Gestes Nicolas Degrenne

Abstract

Accurate lifetime estimation of power semiconductor modules is necessary in applications such as Electrical Vehicles (EV). This paper presents a new Modulation Frequency (MF) model to estimate the thermo-mechanical cycles caused by drive profiles and motor rotating speed. The paper compares lifetime estimations with conventional Low Frequency (LF) models and shows that when using conventional damage law established by power cycling experiments, the numerous lowamplitude cycles at the modulation frequency play a major role in the degradation of the power semiconductor modules.

How to Cite

Gestes, Q., & Degrenne, N. (2017). Impact of Modulation Frequencies on the Lifetime of Power Semiconductor Modules for EV Applications. Annual Conference of the PHM Society, 9(1). https://doi.org/10.36001/phmconf.2017.v9i1.2474
Abstract 228 | PDF Downloads 157

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Keywords

Electrical Vehicles, Semiconductor reliability

References
Choi, U. M., Blaabjerg, F., Jørgensen, S., Iannuzzo, F.,Wang, H., Uhrenfeldt, C., & Munk-Nielsen, S. (2016). Power cycling test and failure analysis of molded Intelligent Power IGBT Module under different temperature swing durations. Microelectronics Reliability.
Degrenne, N., Ewanchuk, J., David, E., Boldyrjew, R., & Mollov, S. (2007). A Review of Prognostics and Health Management for Power Semiconductor Modules. PHM society 2015
Degrenne, N., & Mollov, S. (2016). Real-life vs . Standard Driving Cycles and Implications on EV Power Electronic Reliability, IECON 2016
Hirschmann, D., Tissen, D., Schr¨oder, S., & De Doncker, R.W. (2007). Reliability prediction for inverters in hybrid electrical vehicles. IEEE Transactions on Power Electronics
Lai, W., Chen, Minyou, Ran, L., Alatise, O., ; Xu, S., Philip Mawby, P. (2016). Low Tj Stress Cycle Effect in IGBT Power Module Die-Attach Lifetime Modeling, IEEE Transactions on Power Electronics 2016.
Lutz, J., Schlangenotto, H., Scheuermann, U., and De Doncker, R. (2011). Semiconductor power devices: Physics, characteristics, reliability. Springer, 2011.
Ma, K., Yang, Y., & Blaabjerg, F. (2014). Transient modelling of loss and thermal dynamics in power semiconductor devices. ECCE 2014.
Mainka, K., Thoben, M., & Schilling, O. (2011). Lifetime calculation for power modules, application and theory of models and counting methods. EPE 2011
Qiu, Z., Zhang, J., Ning, P., & Wen, X. (2016). Lifetime evaluation of inverter IGBT modules for electric vehicles mission-profile. ICEMS 2016.
Scheuermann, U., Schmidt, R., & Newman, P. (2014). Power cycling testing with different load pulse durations. PEMD 2014.
Smet, V. (2010). Aging and failure modes of IGBT power modules undergoing power cycling in high temperature environments. Thesis from the University of Montpellier 2.
Vernica, I., Ma, K., & Blaabjerg, F. (2016). Modelling and improvement of thermal cycling in power electronics for motor drive applications. ECCE 2016.
Section
Technical Research Papers