Damage-Based Lifetime Modeling for Power Electronic Devices



Published Sep 4, 2023
Chao Guo Chao Guo Zhonghai Lu


Lifetime modeling is an essential tool for ensuring the reliability of systems. The purpose is to estimate the time before the power electronic device failure so that downtime can be reduced and costly failures can be avoided in industry. This paper will first quantify the cumulative damage in the power cycling test using Junction Temperature Swing and Maximum Junction Temperature, and then formulate the cumulative damage-based lifetime model of power electronic devices. This model assumes that the lifetime is linear to the inverse of the cumulated damage, and shows superior performance in experiments compared with the well-known LESIT model.  

Abstract 30 | PDF Downloads 52



prognostics and health management, lifetime modeling, power electronic devices

Bayerer, R., Herrmann, T., Licht, T., Lutz, J., & Feller, M. (2008). Model for Power Cycling lifetime of IGBT Modules various factors influencing lifetime. In 5th international conference on integrated power electronics systems (p. 1-6).

Busca, C., Teodorescu, R., Blaabjerg, F., Munk-Nielsen, S., Helle, L., Abeyasekera, T., & Rodriguez, P. (2011). An overview of the reliability prediction related aspects of high power IGBTs in wind power applications. Microelectronics Reliability, 51(9), 1903-1907. doi: https://doi.org/10.1016/j.microrel.2011.06.053

Ciappa, M. (2002). Selected failure mechanisms of modern power modules. Microelectronics Reliability, 42(4), 653-667. doi: https://doi.org/10.1016/S00262714(02)00042-2

Hanif, A., Yu, Y., DeVoto, D., & Khan, F. (2019). A comprehensive review toward the state-of-the-art in failure and lifetime predictions of power electronic devices. , 34(5), 4729–4746. doi: 10.1109/TPEL.2018.2860587

Held, M., Jacob, P., Nicoletti, G., Scacco, P., & Poech, M.H. (1997). Fast power cycling test of IGBT modules in traction application. In Proceedings of second international conference on power electronics and drive systems (Vol. 1, pp. 425–430). IEEE. doi: 10.1109/PEDS.1997.618742

Kovaˇcevi´c, I. F., Drofenik, U., & Kolar, J. W. (2010). New physical model for lifetime estimation of power modules. In The 2010 international power electronics conference ecce asia (p. 2106-2114). doi: 10.1109/IPEC.2010.5543755

Manson, S. S., & Dolan, T. J. (1966). Thermal stress and low cycle fatigue. Journal of Applied Mechanics, 33(4), 957-957.

Norris, K. C., & Landzberg, A. H. (1969). Reliability of Controlled Collapse Interconnections. IBM Journal of Research and Development, 13(3), 266-271. doi: 10.1147/rd.133.0266

Oh, H., Han, B., McCluskey, P., Han, C., & Youn, B. D. (2015). Physics-of-Failure, Condition Monitoring, and Prognostics of Insulated Gate Bipolar Transistor Modules: A Review. IEEE Transactions on Power Electronics, 30(5), 2413-2426. doi: 10.1109/TPEL.2014.2346485

Otto, A., & Rzepka, S. (2019). Lifetime modelling of discrete power electronic devices for automotive applications. In Ame 2019 automotive meets electronics; 10th gmm-symposium (p. 1-6).

Otto, A., Rzepka, S., & Wunderle, B. (2019). Investigation of active power cycling combined with passive thermal cycles on discrete power electronic devices. , 141(3), 031012. doi: 10.1115/1.4043646
Special Session Papers