Condition Monitoring of Automotive Smart Systems utilizing Piezoresistive Stress Sensor
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Abstract
It is expected that advanced electronic components and smart systems would dictate the level of innovations in nearly all industrial sectors, including but not limited to automotive and other transport/logistics solutions,
production equipment, energy and other infrastructure, etc. One such component is automotive electronic control unit (ECU), which controls the electrical system or subsystems in motor vehicles. In a conventional ECU, a protective metal case is used to ensure reliability under harsh environmental conditions. Recently, an epoxy molding compound (EMC) was adopted to replace the metal case. The EMC technology reduced the manufacturing cost significantly, yet the presence of a large amount of outer EMC increased the stresses of ECUs during transfer molding process and operations (Gromala, Fischer, Zoller, Andreescu, Duerr, Rapp & Wilde, 2013, Kim, Han, Yadur & Gromala, 2014). The long-term reliability assessment of this newly adopted manufacturing technology should be conducted to make the technology a more viable alternative to various ECUs.
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PHM
Kim, D.-S., Han, B., Yadur, A., and Gromala, P. J. (2014), "Electronic control package model calibration using moiré interferometry," in IEEE 2014 15th Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Han, B., Guo, Y., Lim, C. K., & Caletka, D. (1996), "Verification of Numerical Models Used in Microelectronics Packaging Design by Interferometric Displacement Measurement Methods," Journal of Electronic Packaging, Transaction of the ASME, Vol. 118, No. 3, pp. 157-163.
Palczynska, A., Gromala, P.J., Mayer, D., Han, B. & Melz, T. (2016), "In-situ investigation of EMC relaxation behavior using piezoresistive stress sensor." Microelectronics Reliability 62 (2016): 58-62.
Palczynska, A., Prisacaru, A., Gromala, P.J., Han, B., Mayer, D. & Melz, T. (2016), "Towards prognostics and health monitoring: The potential of fault detection by piezoresistive silicon stress sensor." in IEEE 2016 17th Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).